CAE Based Development Methods for Thermal Management of
LEDs
Dr. Armin Veitl, Altair; Dr. Alexander Dohn, CERAMTEC
AG
LEDs suffer heat problems limiting their success as a light
source. Much attention is given to the heatsink, less to the
layers and barriers between LED and the heat dissipating surface.
A change of concept and material allows significant gains
in thermal management and reliability as well as a simplified
system. Using ceramics as heatsink, circuit carrier and part
of the product design needs some fresh thinking and the willingness
to overcome traditional patterns. A simulation method based
on Computational Fluid Dynamics supports thermal optimization
and technical product design. The paper explains the theoretical
approach, the proof of concept and what and how improvement
with ceramic heatsinks can be achieved.
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